Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.

A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” ...

AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...

Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...

Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...

Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.

The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...

Trusting which data to use and what can be deleted still requires human oversight; startups are at a disadvantage.

Structured Mixed Precision for Efficient Deep Learning Hardware Codesign” was published by Intel. Abstract “In this paper, we ...

A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...

Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for ...

A new technical paper titled “Sensitivity and contrast of indium nitrate hydrate resist evaluated by low-energy electron beam ...